C
Conor Patrick
For various reasons, I need to pad a bit more solder paste onto a fixed-size pad, and I cannot change the stencil thickness without messing up other footprints.
The pad is a 1.2mm diameter circle, and I've drawn the paste to be 1.36mm diameter, so about 0.16mm of the paste extends paste the pad. On my 120um stencil, this 0.16mm "extension" increases the solder on the pad by my target amount of about 28%.
But this is only true if this extension of solder sucks into the pad during reflow. Is it reasonable to expect this to be the case?
In green is the copper, and in teal, is the solder paste.
'https://i.stack.imgur.com/odE8am.png']
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'https://i.stack.imgur.com/08FIxm.png']
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The pad is a 1.2mm diameter circle, and I've drawn the paste to be 1.36mm diameter, so about 0.16mm of the paste extends paste the pad. On my 120um stencil, this 0.16mm "extension" increases the solder on the pad by my target amount of about 28%.
But this is only true if this extension of solder sucks into the pad during reflow. Is it reasonable to expect this to be the case?
In green is the copper, and in teal, is the solder paste.
'https://i.stack.imgur.com/odE8am.png']
'https://i.stack.imgur.com/08FIxm.png']
Login To add answer/comment